Mobile electrostatic carrier
A mobile electrostatic carrier that can instantly bond and release any substrate without adhesive.
The product is an innovative mobile electrostatic carrier developed by Eshylon Scientific. By adhering and reinforcing a thin substrate to a dedicated carrier, it handles fragile substrates without damage. Warped ultra-thin wafers can also undergo conventional processes on existing lines. With exceptional yield and high processing capacity, it meets the needs for substrate thinning. 【Features】 ■ High throughput ■ Improved yield ■ Low cost ■ Wide range of applications ■ No adhesive used *For more details, please visit our website or refer to the PDF materials, and feel free to contact us.
- Company：ナガセテクノエンジニアリング 横浜センター
- Price：Other
